REINFORCED STRUCTURE

The heat spreader of T-FORCE DARK Z/Za series is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. 

ENHANCED HEAT DISSIPATION

With superconductivity – thermally conductive adhesive, it can quickly transfer the heat on IC chip through heat conduction to aluminum alloy cooling module for better heat dissipation. Therefore, the DARK Z/Za memory can offer the finest and smoothest gaming experience and an extreme performance without any lag.

SELECTED IC CHIPS STABLE AND DURABLE

Every IC chip made for TEAMGROUP’s T-FORCE DARK Z/Za DDR4 gaming memory is selected through a rigorous testing process. Every memory stick is tested for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, optimal performance, stability and compatibility.

DARK Za DDR4 GAMING MEMORY

THE BEST SELECTION FOR AMD RYZEN 3000 SERIES

T-FORCE DARK Za DDR4 Gaming Memory is tailor-made for AMD Ryzen 3000 series processor and X570 motherboard. Tested under completed compatibility and stability, which can provide gamers a DDR4 gaming/overclocking memory with excellent quality and optimized performance.

Main Features

     • Armor design for perfect protection

     • Aluminum alloy heat sink with high performance

     • High thermal conductive adhesive

     • Tailor made for AMD

     • Selected high-quality IC 

     • OC Profile Support

     • Energy saving with ultra-low working voltage

Specification

Module Type 

• 288 Pin Unbuffered DIMM Non ECC

Capacity 

• 16GB Kit (8GBx2)

Frequency 

• 3200MHz

Data Transfer Bandwidth

•  25,600 MB/s (PC4 25600)

Latency 

• CL16-18-18-38

Voltage 

• 1.35V

Dimensions

• 43.5(H) x 141(L) x 8.3(W)mm

Heat Spreader 

• Aluminum heat spreader